Soldering Technology Webinars
The Soldering Webinars were developed to keep electronics professionals up-to-date on industry changes in techniques and technology. Anyone can participate. No special hardware is required. Some Webinars may require Windows Media Player 9 or better to view.

Plated Through Hole Fill: Understanding Process and Assembly Requirements

Plated Through Hole Fill is always a hot topic of conversation and we continue to get questions about process issues and acceptable requirement criteria for PCB assemblies. Take a moment to listen in on what the latest acceptable criteria is and what process issues can impact this critical component of any PCB Assembly.

Topics we will be reviewing are:

• Criteria for Hole Fill.
• Differences between Class 2 and Class 3 Requirements.
• New changes for thick boards in Class 2.
• Requirements for Via Holes.

Change is Coming: New Revisions IPC-A-610E, IPC-A-600H and J-STD-001E

Well if you did not have a chance to visit IPC Midwest, there were numerous committee meetings on training and the industry standards we work with every day. Take a moment to get a brief update on the changes that will be coming down the pike that may affect how you inspect, accept and perform your work.

Topics we will be reviewing are:

• Highlights of the IPC Midwest Meetings.
• Proposed changes to IPC-A-610 in to Rev. E.
• Proposed changes to J-STD-001 in to Rev. E.
• Proposed changes to IPC-A-600 in Rev. H.
• Training program status update.

Understanding the Three Threats to PCB’s: Delamination, Measling and Crazing

Back by popular demand, this triple threat to PCB Fabrication is not only a challenge to deal with, but a set of defects that have to be addressed. This webinar will discuss the definition of delamination, measling and crazing, their differences and what the accept/reject criteria is according to IPC-A-600 and IPC-6012.

Topics we will be reviewing are:

• Differences between measles and delamination.
• Causes of measles and delamination.
• What does "wetting is evident" really mean?
• What IPC-A-600 and IPC-6012 define as criteria.

FAQ Series: Top Five Manufacturing
Issues For August

EPTAC Corporation is not only the leading provider of electronics training and certification, but we provide continuous technical support for hundreds of questions asked by our customer base. Second in a series, once again we tackle some of the issues in the industry that may or may not be near and dear to your heart. Tune in and get a technical tune up on some of these widely shared topics.

Topics we will be reviewing are:

• The confusion behind Toe Fillets.
• Securing components with adhesive in Class 3.
• What does "wetting is evident" really mean?
• SIR testing (IPC 2.6.3.3) methods and their application.
• Are Icicles rejectable?

Top Five Manufacturing Issues
For The Month

EPTAC Corporation is not only the leading provider of electronics training and certification, but we provide continuous technical support for hundreds of questions asked by our customer base. This webinar is a chance for us to share some of these issues with you, so that you may benefit and avoid any productions challenges or just give you a chance to look at an issue you may not have been aware of.

Topics we will be reviewing are:

• Missing component markings problem.
• Solder in lead bend area concern.
• Lead and lead free components on a PCB.
• Interpreting crimped wire defects.
• Crimping tinned wires defect.

Getting Involved with the Development and Maintenance of IPC/EIA J-STD-001 and IPC-A-610

Two of the most widely referenced standards in the electronics industry are the IPC/EIA J-STD-001, Requirements for Soldered Electrical and Electronic Assemblies, and IPC-A-610, Acceptability of Electronic Assemblies, but did you know how these documents are updated and maintained by their associated IPC Committees? Learn how you can and should be a part of these ever changing documents and how to submit recommendations to affect change and consistency for the betterment of your company and others.

Topics we will be reviewing are:

• How the IPC committee meetings work.
• How to submit comments and recommendations.
• The document update process.
• Maintaining synergy between all supporting documents.

IPC/EIA J-STD-001 by the Numbers: Understanding the Key Supporting Documents

There is always one document that steals the show, in this case IPC/EIA J-STD-001, Requirements for Soldered Electrical and Electronic Assemblies, but are you aware of the top five(5) supporting documents that are critical to this one standard and directly impact the quality of both incoming and outgoing products? Take a moment to become familiar with new program offerings that address these key standards that will improve your quality and allow you to better converse with your suppliers.

Topics we will be reviewing are:

• The five(5) standards you should really know.
• How these standards directly affect the quality of your products.
• How to improve supply chain communication and support.
• Upcoming programs to educate your staff.