“I’ve been a trainee of
EPTAC’s for the past 12 years
and have always had a
great experience.”
- Kathy Leate,
Raytheon Company
Soldertips
SolderTips: How Long Should it Take to Create a Solder Joint
Question: Are you aware of any time studies or standards that have been developed to determine the amount of time it should take to create a solder joint while hand soldering, either a through-hole, or surface mount component?
SolderTips: Problems With Stress Cracks in Ceramic Components
Question: We are having a problem with ceramic SMT components (CAPS) showing stress patterns and cracking after thermal testing. Have you ever seen this and if so, what is allowed or acceptable according to IPC standards, even with the lack of verified electrical failure of these components?
SolderTips: Dealing with the Problems of Soldering Iron Tips Breaking Down
Question: We are having a problem with soldering tips oxidizing and becoming unusable after a few hours use. We are using a lead-free organic rosin core solder and apply additional liquid rosin flux when soldering fine pitch components. We are running the soldering irons between 750 and 800 F.
SolderTips: Defining Shear Forces for Surface Mounted Components
Question: Is there an IPC or other specification that exists explaining the minimum shear force requirements for surface mounted components?
SolderTip #49: Calibration of Soldering Irons
Question: We have both steady output temperature and temperature variable soldering irons. There has
SolderTip #48: The Cleanliness of Wire and Terminal Connections
Question: What are the specifics on wire and terminal connection cleanliness requirements and how
SolderTip #47: How Long Does it Take to Make A Solder Joint?
Question: I have heard so many conflicting answers as to how many seconds it
SolderTip #46: Open Connections Found on BGA Components
Question: We have been stumped by occasional opens at the corner balls of some
SolderTip #45: Manual Soldering vs Wave Soldering
Question: We assemble simple through hole circuit boards. What are the main factors to




SMT Component Shifting
Question: We have a problem with chip components shifting during the reflow process, which is being detected during automatic optical inspection. The shifting is not limited to a single component, but rather changes daily, where the component shifting occurs and moves from one location to another very randomly.