The Fundamentals of Solder Joint Design – Part 1 – Through Hole Technology (THT)

Have you ever wondered if you have created the perfect solder joint, or for that matter one that is strong enough for the particular application it is being used in? Sure we can pull test and stress the solder joint, but these things don’t fail that way. They fail by many years of fatigue, or more importantly, by stress fractures occurring over years of cycling in the environment.

The Fundamentals of Solder Joint Design – Part 2 – Surface Mount Technology (SMT)

Part 2 in this series, has everything to do with Surface Mount Technology, or more importantly surface mount components. In the previous discussion we explained that the majority of these solder joints fail by many years of fatigue, or more importantly, by stress fractures occurring over years of cycling in the environment. We continue with this series.