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IPC-7711/7721 Specialist

This is a 5-day, advanced course for anyone responsible for quality and reliability of reworked or repaired electronic assemblies. It is a comprehensive hands-on training program with 80% lab work.

Attendees must be experienced solderers.

The IPC-7711 is designed for soldered assembly rework– restoring PCB assemblies to their original drawings.

The IPC-7721 is designed for board repair– restoring a board’s functional capability.

For those seeking certification in just Component Rework (IPC-7711) or just Board Repair (IPC-7721), these course modules may be taken individually. Please call for details.

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Everyone who successfully completes the program will receive:

  • IPC-7711/7721
  • IPC Certificate of Training

Day 1

  • Introduction to IPC-7711/7721
  • Policies and Procedures
  • Common Procedures
  • Wire Splicing (Mesh, Wrap, Hook & Lap)
  • Instructor Demonstration and Skills Development Lab
  • Through-Hole Rework Procedures
  • Instructor Demonstration and Skills Development Lab

Day 2

  • Chip & MELF Removal/Installation and Localized Cleaning
  • Instructor Demonstration and Skills Development Lab
  • SOIC, SOT and Gull Wing Procedures
  • Instructor Demonstration and Skills Development Lab
  • J-Lead and QFP Procedures
  • Instructor Demonstration and Skills Development Lab

Day 3

  • BGA Removal/Replacement Discussion
  • Equipment Selection
  • Conformal Coating Identification, Removal & Replacement

Day 4

  • PWB Circuit Repair
  • Instructor Demonstration and Skills Development Lab
  • Laminate Repair
  • Instructor Demonstration and Skills Development Lab

Day 5

  • Additional Lab Time
  • Comprehensive Review
  • Open Book Exam

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