Achievements

• Author of "Soldering for Electronic Assemblies", Published by Marcel Dekker, 1987
• Published/Presented numerous papers on Soldering and Cleaning
• Chairman of the Assembly & Joining Committee
• Recipient of IPC President Award
• Charter member of J-STD-001 Committee
• Active participant of the following IPC committees: ANSI-J-STD-001, IPC-A-610, IPC-A-600, IPC-6012, J-STD-002, J-STD-003, IPC/WHMA-A-620, J-STD-001 & IPC-A-610 Handbook
• Charter Member on the United Nation Environmental Program - Technical Solvent Options Committee to reduce CFCs
• Co-Author of the IPC-A-600 Training Program "The Acceptability of Printed Boards"
• Recipient of Distinguished Committee Service Award for contributions to: IPC-A-610 & J-STD-001 Specifications, The Development of Surface Mount and Plated Through-hole solder joint evaluation videos
• Master Instructor Trainer for: IPC-A-610, IPC-A-600

Industry Experience

Vice President, Technical Director, Consultant - EPTAC Corporation

• Technical advisor to course development and subject matter
• Development and presentation of seminars
• Working with clients in various industries in developing
  manufacturing processes for both Plated Through-Hole
  and Surface Mount technologies
• Conducting sub-contractor manufacturing audits
• Providing technical support to EPTAC client base
• Providing manufacturing support to all electronics manufacturers
• Conducting process and quality improvement evaluations
• Troubleshooting product manufacturing processes
• Developed and presented seminar series on:  
  • "Deadline to Lead Free"
  • "Thriving in a RoHS/WEEE Environment"
  •  Conducted webinar on Lead Free Product Design

Manufacturing Consultant Engineer Digital Equipment Corporation

• Developed specifications for printed wiring board assembly & fabrication
• Supported Domestic and International
  Electronic Product Manufacturing
• Provided corporate technical consulting services for Quality Workmanship in areas of Soldering and Cleaning
• Provided staff training in areas of solder quality and acceptance criteria
• Developed repair process for removal and replacement of large form factor devices

Manufacturing Engineer
Honeywell Boston Computer Operations

• Manufacturing Engineer for PWB Assembly Operations