RoHS-WEEE Seminar Series: Rework and Repair of Lead-Free Joints

The RoHS/WEEE Seminar Series of webcasts are 100% free.

The RoHS/WEEE Seminar Series was developed to keep electronics professionals up-to-date on industry changes due to environmental regulation. Anyone can participate. No special hardware or software is required.

The RoHS/WEEE Essentials Seminar Series delivers need-to-know information regarding lead-free environmental compliance issues.

These are 1 hour webcasts, presented by the leaders in RoHS/WEEE Training and Consulting, EPTAC Corporation and Design Chain Associates, LLC.

Each webcast will focus on a unique aspect of envirnomental regulation and how it effects everyone in the electronics industry.

Free,1-Hour Webcast
Archived - Play it Now EU REACH

	Presented by	Leo Lambert from EPTAC Corporation About the presenter

The elimination of the heavy metal lead (Pb) from electronic products will drive not only the need to change the manufacturing processes but also the associated rework and repair processes. Although there are many methods defined to rework and repair electronic products, certain parameters will be consistent and must be thoroughly understood to create a reliable process that will provide the customer with a quality product.

Although your products may have initially been designed for and processed with lead-bearing solder alloys, the newly created lead-free alloys now have a different liquidus temperatures and will have more mass than the initial solder joint with different thermal requirements. The marking of products with special material identification as defined in IPC-1066 and JESD-97 to process materials used for assembly will also be critical for the rework/repair centers as they need to know what materials and alloys were used to assemble the product. This session will review these elements along with laminate conditions as they will also be impacted by the higher temperature profiles.

What you will learn

The requirements for thermal profiling
The proper method to measure tip temperatures prior to beginning the manual soldering process
How to determine the difference of the mass of the solder joint from the initial soldering process to the rework process and what that means to the process
How IPC-1066 and JESD-97 impact product marking
How to identify the differences between good and bad solder joints

RoHS/WEEE Seminar Series Schedule
EU REACH: The Future of Substance Regulation	Archived Now Learn more
Rework and Repair of Lead-Free Joints	Archived Now Learn more
Assessing and Maintaining Compliance	Archived Now Learn more
Lead-Free Solder and Joint Training & Inspection	Archived Now Learn more
A Strategic Approach to Environmental Compliance	Feb. 14, 2007 Learn more