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It is here! The most widely utilized inspection standard for electronic assemblies is now updated. The IPC-A-610, “Acceptability of Electronic Assemblies” is now at Revision F and there are things you need to know about this new transition.

With over 814 photos and illustrations, Revision F comes packed with an additional 86 new or changed illustrations supporting and emphasizing the new standards industry practices.

Easier to read, interpret and absorb, this revision has been all about clarity in understanding and clarity with new images and illustrations, all without losing the integrity of the documents requirements.

This revision includes two new SMT termination styles, as well as changes in plated-through hole fill and BGA void criteria. Other major topics include flex attachment, board-in-board and part-on-part, new component orientation and soldering criteria for through hole and SMT, along with new cleaning, marking, coating and laminate requirements just to name a few.

We know you’re busy and staying on top of all the changes that take place in our industry can be daunting. That’s why it’s our mission to keep a step ahead. When an IPC standard is revised, EPTAC is there to evaluate, comprehend, coordinate and communicate these changes to our customers. If you need the latest update on IPC-A-610 Revision F, give us a call and get all the information you need when you need it.

Online training now available!

Welcome to eTraining from EPTAC

Now, in addition to our classroom and onsite training programs, you can enjoy the convenience of online training with live interaction and instruction from EPTAC’s Master Instructors. Add convenience and cut expenses by registering online today.

Note: Documents Required

FOR ALL PARTICIPANTS: This program requires the attendee, prior to class, to purchase the IPC-A-610, “Acceptability of Electronic Assemblies” Revision F standard if you do not currently own one, so that you can easily follow along.

Standards can be purchased through our product group, click here, or by contacting Cheryl Fisher at cherylfisher@eptac.com. Please allow at least two weeks prior to class for shipping.

Date: August 20, 2015
Course Length: 3 Hours
Start Time: 9:00 AM EST
Cost: $79 (eTraining pricing only)
Register

All attendees will receive:

  • Copy of the Presentation
  • Copy (link to) of the Red-Line Document Outlining the Differences

Welcome and Orientation

  • Overview of Program Structure
  • Setting the Stage for the Comparison
  • Document Comparison Section by Section
  • Sampling of New Modifications:
    • New SMT Termination Styles
    • Updates to Plated-Through Hole Fill
    • New Criteria for BGA Voids
    • Revision to Board-in-Board and Part-on-Part Criteria
    • New Criteria for Component Orientation
    • New Soldering Criteria for THT and SMT
    • Enhanced Cleaning, Marking, Coating and Laminate Requirements
  • Highlight of Critical Transformations From E to F
  • Final Wrap Up
  • Review and Additional Question and Answer Session

For a More Interactive Experience:

  • FOR All PARTICIPANTS: This program requires the attendee to purchase the IPC-A-610, “Acceptability of Electronic Assemblies” Revision F standard if you do not currently own one, prior to class, so that you can easily follow along.
  • Standards can be purchased through our product group, click here, or by contacting Cheryl Fisher atcherylfisher@eptac.com. Please allow at least two weeks prior to class for shipping.

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