As Technical Director for EPTAC Corporation, Leo oversees content of course offerings and provides customers with expert consultation
- More than forty years’ experience.
- Specific expertise in soldering, metallurgy and cleaning processes
- Co-author of the industry’s most popular publications, including the IPC-A-600 Training Program, “The Acceptability of Printed Boards”
- Inducted into the IPC Raymond E. Pritchard Hall of Fame
Achievements
- Author of “Soldering for Electronic Assemblies”, Published by Marcel Dekker, 1987
- Published/Presented numerous papers on Soldering and Cleaning
- Chairman of the Assembly & Joining Committee
- Recipient of IPC President Award
- Charter member of J-STD-001 Committee
- Active participant of the following IPC committees: ANSI-J-STD-001, IPC-A-610, IPC-A-600, IPC-6012, J-STD-002, J-STD-003, IPC/WHMA-A-620, J-STD-001 & IPC-A-610 Handbook
- Charter Member on the United Nation Environmental Program – Technical Solvent Options Committee to reduce CFCs
- Co-author of the IPC-A-600 Training program “The Acceptability of Printed Boards”
- Recipient of Distinguished Committee Service Award for contributions to
- IPC-A-610 & J-STD-001 specifications
- The development of Surface Mount and Plated Through-Hole solder joint evaluation videos
- Master Instructor for IPC-A-610, IPC-6012 and IPC-A-600
Industry Experience
Vice President, Technical Director, Consultant, EPTAC Corporation
- Technical advisor to course development and subject matter
- Development and presentation of seminars
- Working with clients of various industries in developing manufacturing processes for both Plated Through-Hole and Surface Mount technologies
- Conducting sub-contractor manufacturing audits
- Providing technical support to EPTAC client base
- Providing manufacturing support to all electronics manufacturers
- Conducting process and quality improvement evaluations
- Troubleshooting product manufacturing processes
- Developed and presented seminar series on
- “Deadline to Lead Free”
- “Thriving in a RoHS/WEEE Environment”
- Conducted webinar on Lead Free Product Design
Manufacturing Consultant Engineer, Digital Equipment Corporation
- Developed specifications for printed wiring board assembly & fabrication
- Supported Domestic and International Electronic Product Manufacturing
- Provided corporate technical consulting services for quality workmanship in areas of soldering and ceaning
- Provided staff training in areas of solder quality and acceptance criteria
- Developed repair process for removal and replacement of large form factor devices
Manufacturing Engineer, Honeywell Boston Computer Operations
- Manufacturing Engineer for PWB Assembly Operations
- Author of “Soldering for Electronic Assemblies”, Published by Marcel Dekker, 1987
