Yes, we are still discussing this issue. It seems to continue to appear. Someone, somewhere has found voids in their solder joints on BGAs, or other surface mounted components. What are you suppose to do? In this session we will take a look at the causes and cures for voids and how process setups, such as your stencil, can be leveraged to reduce the amount of flux entrapment on large scale surface mount areas to deal with solder joint voids and their presence.
Topics we will be reviewing are: