Are you having laminate separation issues with your printed circuit boards? Delamination is showing up more and more today due to increased thermal pressures on assemblies. So how do you address these issues? Learn how this occurs in the production and assembly process, how to deal with it and understand the difference between true delamination and other forms of separation such as measling, haloing and crazing.
Topics we will be reviewing are:
- What is true delamination?
- How this defect occurs and how to prevent it.
- Review of internal and external observations.
- The standards: 610, 600 and 6012 spec.