We receive a variety of questions, each and every day regarding electronics manufacturing that, for the most part, come down to interpreting and understanding various IPC Standards and applying them to day to day operations.
In this webinar, we are going to try and clarify some common topics we received related to IPC-A-610, J-STD-001 and J-STD-006. Join us for a few minutes, and as always, bring your questions about these standards and we will do our best to guide you through these sometimes confusing issues.
Topics we will be reviewing are:
- Lead vs. Lead Free solders on gold plated boards.
- Product operating in high-temp environments exceeding liquid solder states.
- Definition of burnt flux residue, class defects and its’ implications.
- Foreign Object Debris (FOD) in and on PC boards.