It is what we strive for in the electronics manufacturing process, the creation of the perfect solder joint. So many factors enter into this process, but there is one that is constantly discussed in every specification and standard, that even though we do not see it with the unaided eye, is critical to creating that perfect solder joint every time. It is the intermetallic compound. This bond formed every time between solder and a base material is the key. Get this right and you are well on your way to accomplishing your goal. Join us for a moment as we explore this process and how it occurs.
Topics we will be reviewing are:
- The definition of intermetallic compounds.
- How they occur in the soldering/manufacturing process.
- Critical characteristics and how they change over time.
- How the introduction of lead-free alloys impacts this bond.