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Plated Through Hole Fill: Understanding the Process and Assembly Requirements

Plated Through Hole Fill is always a hot topic of conversation and we continue to get questions about process issues and acceptable requirement criteria for PCB assemblies. Take a moment to listen in on what the latest acceptable criteria is and what process issues can impact this critical component of any PCB Assembly.

Topics we will be reviewing are:

  • Criteria for Hole Fill.
  • Differences between Class 2 and Class 3 Requirements.
  • New changes for thick boards in Class 2.
  • Requirements for Via Holes.


Course Length: 20 Minutes
Cost: FREE
Presenter(s): Leo Lambert
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