Plated Through Hole Fill is always a hot topic of conversation and we continue to get questions about process issues and acceptable requirement criteria for PCB assemblies. Take a moment to listen in on what the latest acceptable criteria is and what process issues can impact this critical component of any PCB Assembly.
Topics we will be reviewing are:
- Criteria for Hole Fill.
- Differences between Class 2 and Class 3 Requirements.
- New changes for thick boards in Class 2.
- Requirements for Via Holes.