You’ve heard the saying “the world is shrinking.” Well, in more ways than you think. With the ever increasing proliferation of smart, hand held and mobile devices and the continued shrinking of the electronics they hold, you have to know that there is an ever increasing demand for the electronic devices that make this all possible. The BGA. IPC-7095C “Design and Assembly Process Implementation for BGAs” is fast becoming the key source for dealing with the assembly of this interconnection technology into the products of today. Join us as we step through the contents of this standard and review some of the critical elements you need to understand for your PCB assembly process.
Topics we will be reviewing are:
Overview of the standard and contents.
Selection of BGAs and component considerations.
BGA assembly and mounting criteria.
Accept/Reject criteria and defect/failure studies.