Toll Free: 800.643.7822

VIEW ALL CLASSES

Ask Helena & Leo

Ask our Experts! Helena and Leo can help! With more than 70 years of combined experience in the fields of soldering, metallurgy, PCB fabrication, standards and cleaning processes, Helena & Leo are ready to help you solve your manufacturing problems – no matter how big or small. Get answers and expert advice from them now!

SolderTips

Stay on top of the latest tips, best practices, and trends in the electronics and soldering industries with SolderTips. From common soldering problems to innovative practices, we know all the foremost tips of the trade to help you address critical issues and make pivotal decisions for your business.

Training

EPTAC offers industry-leading solder training and IPC certification classes to professionals and businesses, with a wide variety of classroom, e-training and customized options. Learn how you can get the training you need to increase quality standards, improve productivity, and maximize profits.

Instructors

For over 25 years, EPTAC’s team of knowledgeable and experienced instructors have trained thousands of soldering technicians. Our instructors will teach you to apply soldering and components assembly techniques learned in the classroom to your real-world, everyday work environment.

Because it is all about the soldering...

EPTAC is an internationally-recognized solder training and IPC certification corporation, giving professionals the skills to accelerate their careers, and businesses, the talent to succeed. For over 25 years, EPTAC has been helping corporations increase quality standards, improve productivity, and maximize profits.

It's all about the soldering!
New Solder Training Kits

New Solder Training Kits

EPTAC offers a variety of training kits, including Wire & Terminal, Cable-Harness, Rework and Repair, Lead-Free, Standard Surface Mount, Standard Through-Hole, and more. Click below to learn more about our training kits, manuals, and other certification materials.

Learn More

SolderTips

July 18, 2016

Question: I have always had in the back of my head that burnt flux is a defect for all class 3 assemblies. Upon further review I have not been able to identify the specific section of the IPC-A-610F standard which identifies burnt flux as an acceptable or defect condition.

June 16, 2016

Question: We are having a hard time with the removal of gold from hollow cup connectors. Using lead free solder, we are wicking the solder out with braid, but what is happening is that the pins are getting overheated and coming loose from the connector. Are there other methods we could explore?

June 8, 2016

Question: We have some PCB cards that are flooded with champagne size encapsulated bubbles. While no single bubble bridges between conductors there are numerous small bubbles similar to Figure 10-131 below, None have popped, as they are all encapsulated. Is Figure 10-131 a Defect Photo?

April 27, 2016

Question: The IPC lists different splices for wires including wrap, hook, mesh, and lap. We have all seen wires spliced together by twisting the two wires together forming a gentle twist before soldering. This splice would not have the physical strength of a wrap or hook splice, but it seems like it would offer at least the same strength as a lap splice with less aggravation, since the splice would stay in place during the soldering process. Why does the IPC not recommend creating this type of splice?

April 14, 2016

Question: We are working with components with leads of tin/lead over nickel. After the manufacturing processes, some of the pins are exhibiting what appears to be flaking plating, leaving behind unsolderable surfaces. They will re-tin with flux, but reappear following steam-aging. Is this something you have encountered before?

News

June 1, 2016

Manchester, NH – June 1, 2016 – EPTAC Corporation has joined PowerAmerica to offer IPC Designer Certification to students and faculty of North Carolina State University. This effort supports professional development for careers in electronics by providing instruction framed by industry best practices.

April 3, 2015

Manchester, NH – April 8, 2015 – Kelly Dack, one of the electronic industries most consummate printed circuit board designers, industry supporters and interviewer of the trend setters in the market has joined EPTAC Corporation to support the growth efforts of EPTAC’s IPC Designer Group, lead by Gary Ferrari.

February 24, 2015

Manchester, NH – March 13, 2015 – EPTAC Corporation announced that it has released an update to its popular IPC Certification mobile app on both Apple iOS devices and Google Android phones.

January 14, 2015

Manchester, NH – January 20, 2015 – Michael Creeden, founder of San Diego PCB, Inc. has joined EPTAC Corporation and Gary Ferrari’s training staff to support continued growth in education and training for the printed circuit board design community.

October 14, 2014

Manchester, NH – October 21, 2014 – EPTAC Corporation announced today that along with the acquisition of the Accelper IPC Training Center in Schaumburg, IL, it has also acquired multiple IPC Certification Center licenses for a number of locations across the United States and Canada.

Webinars

September 21, 2016

Counterfeiting has become somewhat prevalent these days, more so in some industries than in others. If there is a profit to be made, this hidden market will find it. When it comes to electronic components, especially in the electronics arena where reliability is involved, there is a deep concern that what you produce as a final product is not compromised in either design or manufacturing.

Ask Helena & Leo

Question: If we are using a solder pot to tin wires and create solder joints (splices), what Maximum Limits of Solder Bath Contaminant do we adhere to (IPC J-STD-001, table 3-1)? Preconditioning or Assembly? What exactly does Preconditioning mean in this context?

Question: While reviewing IPC-A-610, Section 4.1.5.1 (Torque of Threaded Fasteners), the question of “what is the standard industry practice” came up. I checked several reference documents like IPC-AJ-820 but found nothing that explained this to any length. Can you explain what the “standard industry practice” is?

Question: Why did the IPC make the gold removal requirement for Class 2 products a requirement (D2D3) when in Rev E of J-STD-001 it was a process indicator (P2D3)?

Question: We are trying to understand the rationale for choosing to install bifurcated terminals for power lead attachments versus slotted terminals. For years we’ve designed with slotted terminals in PWBs for leaded component (hi-rel transistors and diodes) and stranded wire straps.

Question: Can a PTH component (resistor, fuse, or solid wire) be reliably soldered in-line with stranded wire? Similarly to a wire lap joint, but with a component between the two wires. Is there an IPC standard that covers this situation?