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Question: We are having a hard time with the removal of gold from hollow cup connectors. Using lead free solder, we are wicking the solder out with braid, but what is happening is that the pins are getting overheated and coming loose from the connector. Are there other methods we could explore?
Question: We have some PCB cards that are flooded with champagne size encapsulated bubbles. While no single bubble bridges between conductors there are numerous small bubbles similar to Figure 10-131 below, None have popped, as they are all encapsulated. Is Figure 10-131 a Defect Photo?
Question: The IPC lists different splices for wires including wrap, hook, mesh, and lap. We have all seen wires spliced together by twisting the two wires together forming a gentle twist before soldering. This splice would not have the physical strength of a wrap or hook splice, but it seems like it would offer at least the same strength as a lap splice with less aggravation, since the splice would stay in place during the soldering process. Why does the IPC not recommend creating this type of splice?
Question: We are working with components with leads of tin/lead over nickel. After the manufacturing processes, some of the pins are exhibiting what appears to be flaking plating, leaving behind unsolderable surfaces. They will re-tin with flux, but reappear following steam-aging. Is this something you have encountered before?
Question: Regarding gold removal requirement under Section 4.5.1 of J-STD-001, it allows: “A double tinning process or dynamic solder wave may be used for gold removal prior to mounting the component on the assembly”…
Manchester, NH – June 1, 2016 – EPTAC Corporation has joined PowerAmerica to offer IPC Designer Certification to students and faculty of North Carolina State University. This effort supports professional development for careers in electronics by providing instruction framed by industry best practices.
Manchester, NH – April 8, 2015 – Kelly Dack, one of the electronic industries most consummate printed circuit board designers, industry supporters and interviewer of the trend setters in the market has joined EPTAC Corporation to support the growth efforts of EPTAC’s IPC Designer Group, lead by Gary Ferrari.
Manchester, NH – March 13, 2015 – EPTAC Corporation announced that it has released an update to its popular IPC Certification mobile app on both Apple iOS devices and Google Android phones.
Manchester, NH – January 20, 2015 – Michael Creeden, founder of San Diego PCB, Inc. has joined EPTAC Corporation and Gary Ferrari’s training staff to support continued growth in education and training for the printed circuit board design community.
Manchester, NH – October 21, 2014 – EPTAC Corporation announced today that along with the acquisition of the Accelper IPC Training Center in Schaumburg, IL, it has also acquired multiple IPC Certification Center licenses for a number of locations across the United States and Canada.
Standards, standards and more standards. When it comes to bare printed circuit boards, two key documents stand out, the IPC-A-600 “Acceptability of Printed Boards” and IPC-6012 “Qualification and Performance Specification for Rigid Printed Boards”. With that said, which document is important to you and more importantly how do you use these standards and apply their requirements in everyday situations?
Question: While reviewing IPC-A-610, Section 220.127.116.11 (Torque of Threaded Fasteners), the question of “what is the standard industry practice” came up. I checked several reference documents like IPC-AJ-820 but found nothing that explained this to any length. Can you explain what the “standard industry practice” is?
Question: Why did the IPC make the gold removal requirement for Class 2 products a requirement (D2D3) when in Rev E of J-STD-001 it was a process indicator (P2D3)?
Question: We are trying to understand the rationale for choosing to install bifurcated terminals for power lead attachments versus slotted terminals. For years we’ve designed with slotted terminals in PWBs for leaded component (hi-rel transistors and diodes) and stranded wire straps.
Question: Can a PTH component (resistor, fuse, or solid wire) be reliably soldered in-line with stranded wire? Similarly to a wire lap joint, but with a component between the two wires. Is there an IPC standard that covers this situation?
Question: I am working through the online testing for our employees. I have a question regarding the score for the solder board for J-STD-001 and how and when that gets submitted in the system. Having worked through the first test and realizing that the test does not get submitted until the end date, that was entered in the system when it was set up, I was thinking that on that date it may ask for a solder score. It does not. Where does this get submitted?