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EPTAC offers industry-leading solder training and IPC certification classes to professionals and businesses, with a wide variety of classroom, e-training and customized options. Learn how you can get the training you need to increase quality standards, improve productivity, and maximize profits.
For over 30+ years, EPTAC’s team of knowledgeable and experienced instructors have trained thousands of soldering technicians. Our instructors will teach you to apply soldering and components assembly techniques learned in the classroom to your real-world, everyday work environment.
EPTAC is an internationally recognized leader in solder training and IPC certification, providing professionals with the skills to accelerate their careers, and businesses, the talent to succeed. For over 30 years, EPTAC has been helping corporations increase quality standards, improve productivity, and maximize profits. With fourteen (14) locations in North America, EPTAC continues to expand its offerings and exceptional instructional staff to provide easy access to knowledge and skill based programs when and where industry demands it. Access our scheduled programs through our website, easy to use APP, or schedule your own corporate on-site training. Only from EPTAC.
Posted on 1.22.20 by Leo Lambert
As technological advancements with production and materials keep making major leaps forward, the business of counterfeit parts also continues to grow in scale and capability. With many companies outsourcing their production to third parties, the risk of counterfeit components rises, putting the integrity of their designs at stake. What are Counterfeit Electronics? While there are…
Posted on 12.23.19 by Leo Lambert
Printed circuit boards, or PCBs, are the backbone of most electronics, and they mechanically support and connect the electronic components that are soldered to them. Although PCBs are small, the process to prototype and manufacture them is quite lengthy. Many companies outsource this process to third parties in Asia, which can be slow and expensive. However, the advent of 3D printing has ushered in a new era for PCB development, and what was once labeled too costly and time consuming is now a production method that can save time, money, and resources.
Posted on 11.20.19 by Leo Lambert
As we’ve discussed on this blog many times before, Artificial Intelligence (AI) is everywhere nowadays. We’ve addressed the impact of AI in retail spaces and across social media and the web, but what we haven’t written about is how AI can have the impact that it does across multiple markets and industries. The two key subsets of artificial intelligence that you need to understand are machine learning and deep learning.
Question: We found an article online about solder pot maintenance and the removal of dross, specifically there is an interest to us in the “changing bar solder” Section. Does turning up the solder pot too high cause impurities to collect on parts? Can you comment on this?
Question: We all have from time to time had solder, be it in paste or wire form, sitting on shelves for what seems like years. I know there are all types of variables related to its’ longevity, but given this, what’s really going on with the expiration dates and are there tests you can perform to validate or extend this period?
Question: We are having a discussion about whether or not solder can touch a component body; in particular, we have a plastic SMT component where the solder has wicked up to the body on the legs. Sections are shown below. Is this condition acceptable under any circumstances, or is it always a reject in all three classes?
Question: I have always had in the back of my head that burnt flux is a defect for all class 3 assemblies. Upon further review I have not been able to identify the specific section of the IPC-A-610F standard which identifies burnt flux as an acceptable or defect condition.
Question: We are having a hard time with the removal of gold from hollow cup connectors. Using lead free solder, we are wicking the solder out with braid, but what is happening is that the pins are getting overheated and coming loose from the connector. Are there other methods we could explore?
Manchester, NH – January 30, 2019 – Leo Lambert, Vice President and Technical Director at EPTAC Corporation has been given the highest IPC Honor, The Raymond E. Prichard Hall of Fame Award for his extraordinary contributions to the electronics industry and the IPC. Leo received this award and induction during the IPC APEX EXPO in…
Manchester, NH – June 1, 2016 – EPTAC Corporation has joined PowerAmerica to offer IPC Designer Certification to students and faculty of North Carolina State University. This effort supports professional development for careers in electronics by providing instruction framed by industry best practices.
Manchester, NH – April 8, 2015 – Kelly Dack, one of the electronic industries most consummate printed circuit board designers, industry supporters and interviewer of the trend setters in the market has joined EPTAC Corporation to support the growth efforts of EPTAC’s IPC Designer Group, lead by Gary Ferrari.
Manchester, NH – March 13, 2015 – EPTAC Corporation announced that it has released an update to its popular IPC Certification mobile app on both Apple iOS devices and Google Android phones.
Manchester, NH – January 20, 2015 – Michael Creeden, founder of San Diego PCB, Inc. has joined EPTAC Corporation and Gary Ferrari’s training staff to support continued growth in education and training for the printed circuit board design community.
EPTAC offers a variety of training kits, including Wire & Terminal, Cable-Harness, Rework and Repair, Lead-Free, Standard Surface Mount, Standard Through-Hole, and more. Click below to learn more about our training kits, manuals, and other certification materials.Learn More
If you have ever worked with IPC J-STD-001 in your life, you have inevitably come across the SHALL’s and SHALL NOT’s littered throughout the document and the brackets that follow. Do you really understand how to interpret their meaning? We might be able to help.
Question: What are the requirements for Visual Acuity? Could not find a specific reference in either J-STD-001 or IPC -A-610.
Question: We have boards with PEM® nuts being soldered during production. Has IPC established minimum soldering criteria for SMT PEM®s?
Question: We have a through-hole integrated circuit (IC) component that has good wetting when it goes through the wave soldering machine, and the solder climbs pretty far up the lead.
Question: If we are using a solder pot to tin wires and create solder joints (splices), what Maximum Limits of Solder Bath Contaminant do we adhere to (IPC J-STD-001, table 3-1)? Preconditioning or Assembly? What exactly does Preconditioning mean in this context?
Question: While reviewing IPC-A-610, Section 22.214.171.124 (Torque of Threaded Fasteners), the question of “what is the standard industry practice” came up. I checked several reference documents like IPC-AJ-820 but found nothing that explained this to any length. Can you explain what the “standard industry practice” is?