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Posted on 12.14.17 by Leo Lambert
As an emerging OEM/EMS company, you’ve managed to transform your operation from a small, local shop into a large industry player. Both change and growth have forced you to adopt new practices and proficiencies to remain competitive. Understanding that efficient production is vital to your overall success, you hire and train staff to be IPC…
Posted on 11.28.17 by Leo Lambert
The manufacturing of printed circuit boards, or PCB’s, has proven to be a rapidly growing aspect of the assemblies’ industry. As indicated by an increase in the PCB’s book-to-bill ratio, demand, as of August 2017, is currently exceeding the supply of PCB’s. With a shortage in supply emerges a new opportunity for businesses within the…
Posted on 10.25.17 by Leo Lambert
The North American electronics assembly industry is rock solid. Sales numbers for semiconductor and electronics manufacturers are rising steadily, and printed circuit board sales are on the uptick. The U.S. Purchasing Managers’ Index is reflecting a positive position for industry sales, which also bodes well for sales projections over the next few months.
Question: We all have from time to time had solder, be it in paste or wire form, sitting on shelves for what seems like years. I know there are all types of variables related to its’ longevity, but given this, what’s really going on with the expiration dates and are there tests you can perform to validate or extend this period?
Question: We are having a discussion about whether or not solder can touch a component body; in particular, we have a plastic SMT component where the solder has wicked up to the body on the legs. Sections are shown below. Is this condition acceptable under any circumstances, or is it always a reject in all three classes?
Question: I have always had in the back of my head that burnt flux is a defect for all class 3 assemblies. Upon further review I have not been able to identify the specific section of the IPC-A-610F standard which identifies burnt flux as an acceptable or defect condition.
Question: We are having a hard time with the removal of gold from hollow cup connectors. Using lead free solder, we are wicking the solder out with braid, but what is happening is that the pins are getting overheated and coming loose from the connector. Are there other methods we could explore?
Question: We have some PCB cards that are flooded with champagne size encapsulated bubbles. While no single bubble bridges between conductors there are numerous small bubbles similar to Figure 10-131 below, None have popped, as they are all encapsulated. Is Figure 10-131 a Defect Photo?
Manchester, NH – June 1, 2016 – EPTAC Corporation has joined PowerAmerica to offer IPC Designer Certification to students and faculty of North Carolina State University. This effort supports professional development for careers in electronics by providing instruction framed by industry best practices.
Manchester, NH – April 8, 2015 – Kelly Dack, one of the electronic industries most consummate printed circuit board designers, industry supporters and interviewer of the trend setters in the market has joined EPTAC Corporation to support the growth efforts of EPTAC’s IPC Designer Group, lead by Gary Ferrari.
Manchester, NH – March 13, 2015 – EPTAC Corporation announced that it has released an update to its popular IPC Certification mobile app on both Apple iOS devices and Google Android phones.
Manchester, NH – January 20, 2015 – Michael Creeden, founder of San Diego PCB, Inc. has joined EPTAC Corporation and Gary Ferrari’s training staff to support continued growth in education and training for the printed circuit board design community.
Manchester, NH – October 21, 2014 – EPTAC Corporation announced today that along with the acquisition of the Accelper IPC Training Center in Schaumburg, IL, it has also acquired multiple IPC Certification Center licenses for a number of locations across the United States and Canada.
EPTAC offers a variety of training kits, including Wire & Terminal, Cable-Harness, Rework and Repair, Lead-Free, Standard Surface Mount, Standard Through-Hole, and more. Click below to learn more about our training kits, manuals, and other certification materials.Learn More
Question: We have boards with PEM® nuts being soldered during production. Has IPC established minimum soldering criteria for SMT PEM®s?
Question: We have a through-hole integrated circuit (IC) component that has good wetting when it goes through the wave soldering machine, and the solder climbs pretty far up the lead.
Question: If we are using a solder pot to tin wires and create solder joints (splices), what Maximum Limits of Solder Bath Contaminant do we adhere to (IPC J-STD-001, table 3-1)? Preconditioning or Assembly? What exactly does Preconditioning mean in this context?
Question: While reviewing IPC-A-610, Section 22.214.171.124 (Torque of Threaded Fasteners), the question of “what is the standard industry practice” came up. I checked several reference documents like IPC-AJ-820 but found nothing that explained this to any length. Can you explain what the “standard industry practice” is?
Question: Why did the IPC make the gold removal requirement for Class 2 products a requirement (D2D3) when in Rev E of J-STD-001 it was a process indicator (P2D3)?