Scroll

Toll Free: 800.643.7822

IPC Advanced Designer Certification

IPC PCB Designer Certification

Continuing the educational series for PCB Design, the IPC Advanced Designer Certification or (CID+) is for Certified CID’s looking to continue and expand their educational understanding of board design and production problem solving started from their successful completion of the IPC Designer Certification or CID.

This 4-day, lectured course (3-days lecture, 1-day review and testing), delves into design and fabrication issues that go beyond the fundamentals of layout, component placement and routing consideration to understanding fabrication materials, testing of not only electrical, but physical aspects of boards, electrical and signaling issues, complex component mounting strategies and requirements, and fabrication considerations for high end designs and circuitry.

The program continues the utilization of IPC-2221 “Generic Standard on Printed Board Design” and IPC-2222 “Sectional Design Standard for Rigid Organic Printed Boards”, reviewing in more detail the parameters and requirements within these standards to gain a better appreciation between board design and doing so in such a way that the designer manages problematic issues that can occur in the production environment.

Taught by recognized industry professionals, this program enhances your experience by exposing you to IPC Certified Instructors who possess a broad expertise and appreciation for the process. This course is open to anyone who has completed the IPC Designer Certification CID.

IPC Designer Certification Online

VIEW ALL CLASSES


Everyone who successfully completes the program will receive:

  • IPC Certificate of Training



DAY 1

  • DESIGN CONSIDERATIONS
    1. Board Material Properties
      Plating Characteristics for Conductors and Holes
      Surface Finish and Treatment Characteristics
      Solder Mask/Coating Material Properties and Compatibility
      Homogeneous Material Performance Capability
      Statistical Process Control (SPC) with Test Coupons
      Reliability and Stress Test Evaluations
      Quality Life Cycle Tracking
      Materials and Compliance
      Solder Joint Reliability
  • PRINTED BOARD CHARACTERISTICS
    1. Design Standards to meet Fabrication and Assembly Goals
      Manufacturing Equipment Size Limitations
      Printed Board Length to Width Relationships
      Balanced Construction and Copper Balance
      Printed Board Thermal Management Techniques
      Controlled Expansion Constructions Using Special Cores
      Non-Standard Mechanical Outline (Case) Integration
      Individual Board Tooling Considerations
      HDI – Interconnect Vias Types and Strategies

DAY 2

  • ELECTRICAL PARAMETERS
    1. Physical Board Dielectric Parameters
      Shielding Techniques to Prevent Signal Emission
      EMI and EMC Emissions/Susceptibility
      General Principles of Impedance Control
      Signal Integrity Analysis
      Electrical Clearance and Dielectric Spacing
      Power and Ground Routing Techniques
      Conductor Current Carrying Capacity vs. Temperature Rise
      Layout Approaches for Crosstalk Minimization

DAY 3

  • COMPONENT AND ASSEMBLY ISSUES
    1. Component Comparison Between Area and Peripherals Arrays
      Component Types and Mounting Strategies
      Component Placement Strategy and Assembly Sequence
      Component Mounting Shock and Vibration Requirements
      Evaluation of Component Attachment Methods
  • DOCUMENTATION AND DIMENSIONING
    1. Parts List Development – BOM (Bill of Materials)
      Printed Board Tolerance Analysis
      Document to Facilitate Design to Fabrication Interface
      Printed Board & Assembly Data Format Standardization
      Assembly, Repair & Modification Tools and Techniques

DAY 4

  • Q & A
  • CERTIFICATION TESTING


Requires successful completion and IPC Certification of the IPC Designer Certification (CID) Program.
This Program is delivered in English only.

More Classes