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IPC Designer Certification

IPC PDB Designer Schedule

The IPC Designer Certification (CID) is a professional development program introducing the basics of PCB design and a better understanding between design and actual assembly of the final product. The program reviews the production process and how changes in PCB layout can reduce production problems further down the road.

This 4-day, lectured course (3-days lecture, 1-day review and testing), goes beyond the fundamentals of component placement and track routing to encompass an understanding of all the elements that go into product development utilizing IPC-2221 “Generic Standard on Printed Board Design” and IPC-2222 “Sectional Design Standard for Rigid Organic Printed Boards”.

The program covers guidance and requirements for printed board assembly and design parameters from component mounting, interconnecting structures, conductor characteristics, surface finishes, board electrical test, thermal stress, panelization, laminate selection, scoring and routing parameters, board thickness tolerance, nonfunctional lands, hole aspect ratios, via hole size and printed board edge spacing just to name a few.

Taught by recognized industry professionals, this program enhances your experience by exposing you to IPC Certified Instructors who possess a broad expertise and appreciation for the process. This course is also an excellent course for anyone involved in the development, design and fabrication, at any level from sales, management, procurement, or quality in printed circuit board production.

IPC Designer Certification Online

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Everyone who successfully completes the program will receive:

  • IPC Certificate of Training


DAY 1

  • DESIGN CONSIDERATIONS
    1. Considerations for Design
      Placement and Routing Techniques
      Electrical Characteristics
      Copper Clad Laminates
      Holes in Printed Boards
      Drilling and Hole Locations
      Features Formed in Copper
  • THERMAL, RELIABILTTY, AND TESTING ISSUES
    1. Thermal Management of Boards
      Thermal Management of Assemblies
      Reliability
      Board and Assembly Testing
  • ELECTRICAL PARAMETERS
    1. Printed Board and Assembly Viewing Principles
      Introduction to Datum Dimensioning
      Grid Systems
      Tooling Holes and Fiducials
      Board and Assembly Panelization
      Panel/Pallet Separation Methods

DAY 2

  • COMPONENT TYPES
    1. Basic Components
      Embedded Components
      Edge Board Connectors
      Stiffeners, Bus Bars, Sockets, Jumpers and Terminals, MELFs, Eyelets
  • COMPONENT AND ASSEMBLY ISSUES
    1. Parts List Development
      Printed Board Tolerance Analysis
      Documentation to Facilitate Design to Fabrication Interface
      Printed Board and Assembly Data Format Standardization
      Component Insertion & Attachment Techniques
      Solder Processes
      Clinched Leads
  • BOARD SURFACE TREATMENTS
    1. Solder Mask, Conformal Coatings, Protective Coatings/Surface Finishes
      Legend
      Conductive Inks

DAY 3

  • DOCUMENTATION AND DIMENSIONING
    1. Documentation and Classifications
      Basic Drawing Formats
  • SCHEMATIC AND LOGIC DIAGRAMS
  • FABRICATION AND TOLERANCING REQUIREMENTS
    1. Board Fabrication Documentation
      Dimensioning and Tolerancing
  • ASSEMBLY DOCUMENTATION AND BOMS

DAY 4

  • Q & A
  • CERTIFICATION TESTING


This Program is delivered in English only.

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