This program is for experienced solderers seeking an in depth knowledge of the J-STD-001 Document. The course reviews this document and helps students learn how to interpret the criteria. Open and closed book exams are required after each module. Hand Soldering skills need to be performed and pass inspection. Students must pass both exams and soldering in order to successfully complete this program.
This class is not designed to teach anyone how to solder. The focus is on the knowledge of the J-STD-001 criteria.
The program is divided into 5 one-day modules, each covering a different area of soldered electronics assemblies. Students may be trained in any combination of modules that includes module 1.
This course addresses all three classes of manufacturing in Wires and Terminals, Through-Hole and Surface Mount Technologies.
An optional Module 6 is available for anyone needing certification to the J-STD-001 Space Addendum.
Everyone who successfully completes the program will receive:
- The J-STD-001
- IPC Certificate of Training
DAY 1 – Module 1 Overview of J-STD-001
Students will learn the requirements of J-STD-001 and related standards as they apply to operators and inspectors involved in the assembly of products to the requirements of J-STD-001. Module 1 is a prerequisite to all other modules.
- Course Overview
- Classes of Equipment
- Solder Theory
- Solder Flux and Solder Alloys
- Facilities, Tools & Equipment Training
- PTH – Assembly/Solder
- Surface Mount Technology
- Module 1 Review
- Module 1 Examination
DAY 2 – Module 2 – Wires & Terminals
Students will learn the requirements of J-STD-001, and demonstrate the skills for stripping and tinning wire and hand soldering wires of different gauges to various types of commonly used solder terminals.
- Wire Preparation
- Solder to Terminals
- Terminal Inspection
- Wire & Terminal Demonstration
- Wire & Terminal Lab
- Module 2 Review
- Module 2 Examination
DAY 3 – Module 3 – Through-Hole Technology
Students will learn the requirements of J-STD-001, and demonstrate the skills for preparing and mounting Through-Hole components to PWBs.
- Lead Preparation
- Component Mounting
- PTH Inspection Criteria
- PTH Soldering Demonstration
- PTH Lab
- Module 3 Review
- Module 3 Examination
DAY 4 – Module 4 – Surface Mount Technology
Students will learn the requirements of J-STD-001, and demonstrate the skills for preparing and mounting Leaded and Leadless Surface Mount components to PWBs.
- SMT Criteria
- SMT Inspection Criteria
- SMT Demonstration
- SMT Lab
- Module 4 Review
- Module 4 Examination
DAY 5 – Module 5 – Inspection Methodology
Students will learn the quality and inspection requirements of J-STD-001.
- Theory of Inspection, SPC
- Defect Definition and Disposition
- Inspection Skills Demonstration
- Inspection Skills Lab
- Module 5 Review
- Module 5 Examination