WEBINAR - UHDI: Q&A - Manufacturing and Inspection Insights with Leo Lambert

UHDI: Q&A - Manufacturing and Inspection Insights with Leo Lambert

Join us as we explore how UHDI manufacturing is reshaping design rules, materials, and inspection requirements — and what these changes mean for the future of advanced electronics production.

As products continue to shrink and performance demands rise, HDI technology is rapidly evolving into Ultra High-Density Interconnect (UHDI). Once reserved for IC substrates and flip-chip packaging, UHDI is now driving a new level of convergence between semiconductor packaging and system-level PCB design.

We’ll close the session with a live Q&A, giving you the opportunity to ask your questions directly and gain deeper insights from industry expert Leo Lambert.

                                     

Leo Lambert is the Technical Director at EPTAC and a columnist for I-Connect 007. A recognized expert in soldering, metallurgy, and cleaning processes, he has authored influential industry papers, chaired major assembly committees, and helped shape global manufacturing standards. Honored with the Raymond E. Pritchard Hall of Fame Award and the President’s Award from the Global Electronics Association, Leo brings decades of hands-on expertise to EPTAC’s award-winning training and certification programs, empowering teams to achieve higher reliability, productivity, and compliance in modern electronic assembly.