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IPC J-STD-001: 5.1.3 Question on Wire Tinning

Question: 5.1.3 States that wires must be tinned if soldered to boards with some exceptions. My question is if the stranded wire is individually tinned wire, not “topcoat” or bare copper, does this count? Would it need to be dipped in a solder pot (tinned) before soldering in a through hole?

Question: 5.1.3 States that wires must be tinned if soldered to boards with some exceptions. My question is if the stranded wire is individually tinned wire, not “topcoat” or bare copper, does this count? Would it need to be dipped in a solder pot (tinned) before soldering in a through hole?

Answer: The tinning of the wire strands is a manufacturing process to protect the wire strands from oxidizing. When J-STD-001 mentions that the wire needs, or shall be tinned, it means the entire wire bundle must be soldered together. This can be accomplished two ways, one with a soldering iron and cored solder, or secondly with a flux dip and dipping the wire into a solder pot.

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