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EPTAC Updates on New Soldering Assembly Specs

Posted on 5st March, 2012 by Mark Pilkington

EPTAC’s Vice President and Technical Director Leo Lambert, who is also the chair of the IPC Assembly and Joining Committee, discusses some of the progress being made in the Soldering Assembly Specifications as well as the new documentations being released. He also touches on the Soldering Competition at the Show. Click here for video…

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