Leo Lambert will host the Assembly & Joining Processes Committee planning meeting on Sunday April 10, 2011 at APEX 2011 in Las Vegas, Nevada. This is a planning meeting for the task group and subcommittee leaders of the Assembly and Joining Processes Committees.
At EPTAC Corporation, Leo Lambert oversees content of course offerings, IPC Certification programs and provides customers with expert consultation in electronics manufacturing, including RoHS/WEEE and lead free issues. He is the IPC General Chairman for the Assembly/Joining Process Committee.
Leo is the past Chair of the Technical Activities Executive Committee for IPC and is currently General Chair of the Assembly & Joining Committee. This committee covers all the standards and specifications related to assembly, soldering and related materials.
Leo has participated in IPC since 1976 and was awarded the IPC Presidents Award in 1988 for his work in Surface Finish plated through hole solderability program as well as numerous Distinguish Committee Service awards, Committee Leadership awards and Service Committee awards.
