Question: Can you tell me if there are other reasons that components tombstone? We have looked at the pad size and the amount of paste on the pads. If this helps, the laminate is flex kapton.
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IPC-A-610 Revision F Paragraph 188.8.131.52 Supported Holes - Solder - Vertical Fill (A)
Question: We have a couple of questions regarding the new IPC-A-610 Revision F document and vertical fill. They are: . Acceptable – Class 1,23: Minimum vertical fill of 50% or 1.2 mm for components with 14 or more leads. What is the...
Soldering Wires to Pads With a Lap Joint
Question: I was wondering if you might be able to help me. We have some strain gauges on an assembly and need to solder wires to the strain gauge pads. We are concerned that we might not be able to get two wires soldered on flat against the...
IPC-5704 vs IPC-6012 Bare Board Cleanliness Comparison
Question: I am reviewing IPC-5704, and have a question. When reviewing table 4-1, the chloride limit is 0.75 ug/cm2, which converts to 4.4 ug/in2, however; IPC 6012 still has the board cleanliness limit for sodium chloride as 1.56 ug/cm2...
Ceramic CCA's and Aqueous Wash and Bake Out Prior to Parylene Coating
Question: I have a question concerning ceramic CCA and their bake out after aqueous wash cycle prior to parylene coating. In theory, parylene deposition will draw off any moisture before the coating process. Currently we bake at 149F for one...
Interpretation of the J-STD-001 / IPC-A-610 Turret Terminal Soldering
Question: I am an IPC certified J-STD-001 and A-610 Trainer and have a question that I’m hoping you can help clarify for me. It is in regards to the interpretation of the acceptability of the top side solder filet requirements for a soldered...
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