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Solder Selection for Printed Circuit Boards and Terminals
Question: I know for tinning stranded wires you should not use Type H or M flux, so we are ordering a No-clean solder Sn63Pb37 with a flux designator ROL0. My question is, would you use that ROL0 solder on the entire solder termination when...
IPC J-STD-001: 5.1.3 Question on Wire Tinning
Question: 5.1.3 States that wires must be tinned if soldered to boards with some exceptions. My question is if the stranded wire is individually tinned wire, not “topcoat” or bare copper, does this count? Would it need to be dipped in a...
SMT Polyphenylene Sulfide (PPS) Film Capacitors and Defects
Question: Are there any specifications referencing Polyphenylene Sulfide (PPS) film capacitors and horizontal lifts on sides (or cracks) when heated like ceramic chips if cracked horizontal, or is it considered a defect for all three classes?
Addressing Circular Mil Area (CMA) Buildup
Question: We work in cable assemblies and had a question about Circular Mil Area (CMA) buildup. We find ourselves frequently building up our conductors when using a crimp style contact, using the Rule of 3’s (28 AWG folded in half would be...
Dip Tinning Conductors with Low Temperature Insulation and Solder Pot Contamination
Question: We have an application that due to the type of stranded conductor being used, it may be necessary to semi-strip the insulation, flux and dip the conductor with the insulation slug still in place to prevent the conductor from...