Looking for solder training standards, manuals, kits, and more?

Visit soldertraining.com

WEBINARS

Plated Through Hole Fill: Understanding the Process and Assembly Requirements

Plated Through Hole Fill is always a hot topic of conversation and we continue to get questions about process issues and acceptable requirement criteria for PCB assemblies. Take a moment to listen in on what the latest acceptable criteria is and what process issues can impact this critical component of any PCB Assembly.

Course Length: 20 Minutes | Cost: FREE | Presenter: Leo Lambert

Plated Through Hole Fill is always a hot topic of conversation and we continue to get questions about process issues and acceptable requirement criteria for PCB assemblies. Take a moment to listen in on what the latest acceptable criteria is and what process issues can impact this critical component of any PCB Assembly.

Topics we will be reviewing are:

  • Criteria for Hole Fill.
  • Differences between Class 2 and Class 3 Requirements.
  • New changes for thick boards in Class 2.
  • Requirements for Via Holes.

Have a question about training or IPC certification?

EPTAC has the knowledge and expertise to help you train your staff, understand your process, and increase production. We are committed to answering your questions promptly, and we look forward to hearing from you.