Looking for solder training standards, manuals, kits, and more?

Webinars

The Fundamentals of Solder Joint Design – Part 1 – Through Hole Technology (THT)

Have you ever wondered if you have created the perfect solder joint, or for that matter one that is strong enough for the particular application it is being used in? Sure we can pull test and stress the solder joint, but these things don’t fail that way. They fail by many years of fatigue, or more importantly, by stress fractures occurring over years of cycling in the environment.

 
 
  DOWNLOAD PDF PRESENTATION
  WATCH ON DEMAND

Course Length: 23 Minutes | Cost: FREE | Presenter: Leo Lambert

Have you ever wondered if you have created the perfect solder joint, or for that matter one that is strong enough for the particular application it is being used in? Sure we can pull test and stress the solder joint, but these things don’t fail that way. They fail by many years of fatigue, or more importantly, by stress fractures occurring over years of cycling in the environment. So after all these calculations, are we even close to getting an idea as to whether or not, we created the right joint for the design and use? Take a moment to spend some time with us as we review some of the fundamentals and formulas that help us at least get in a comfortable ballpark for these predictions.

Topics we will be reviewing are:

  • Solder Joint Creation 101 for Through Hole Components.
  • The three structural components of the THT solder joint.
  • Applicable formulas for THT designs.
  • Examples of these formulas in action.

Have a question about training or IPC certification?

EPTAC has the knowledge and expertise to help you train your staff, understand your process, and increase production. We are committed to answering your questions promptly, and we look forward to hearing from you.