Gold removal from component solderable surfaces has, for many years, long been required, but do you really understand the value of, or why we go through this process? Why do we have it there in the first place? Take a moment to learn some of the history of this process and why it is critical for you to understand why we need to pay attention to this precious contaminate.
Topics we will be reviewing are:
The history of the process.
Review of J-STD-001 Section 4.5.1 requirements.
Solder joint and solder pot gold contamination.
The impact of not removing gold materials.
Have a question about training or IPC certification?
EPTAC has the knowledge and expertise to help you train your staff, understand your process, and increase production. We are committed to answering your questions promptly, and we look forward to hearing from you.