Plated Through Hole Fill is always a hot topic of conversation and we continue to get questions about process issues and acceptable requirement criteria for PCB assemblies. Take a moment to listen in on what the latest acceptable criteria is and what process issues can impact this critical component of any PCB Assembly.
Change is Coming: New Revisions J-STD-001E, IPCA- 610E and IPC-A-600H
Well if you did not have a chance to visit IPC Midwest, there were numerous committee meetings on training and the industry standards we work with every day. Take a moment to get a brief update on the changes that will be coming down the pike that may affect how you inspect, accept and perform your work.
Understanding the Three Threats to PCB’s: Delamination, Measling and Crazing
Back by popular demand, this triple threat to PCB Fabrication is not only a challenge to deal with, but a set of defects that have to be addressed. This webinar will discuss the definition of delamination, measling and crazing, their differences and what the accept/reject criteria is according to IPC-A-600 and IPC-6012.
FAQ Series: Top Five Manufacturing Issues For August 2009
EPTAC Corporation is not only the leading provider of electronics training and certification, but we provide continuous technical support for hundreds of questions asked by our customer base. Second in a series, once again we tackle some of the issues in the industry that may or may not be near and dear to your heart. Tune in and get a technical tune up on some of these widely shared topics.
Top 5 Manufacturing Issues for the Month
EPTAC Corporation is not only the leading provider of electronics training and certification, but we provide continuous technical support for hundreds of questions asked by our customer base. This webinar is a chance for us to share some of these issues with you, so that you may benefit and avoid any productions challenges or just give you a chance to look at an issue you may not have been aware of.
Getting Involved with the Development and Maintenance of IPC/EIA J-STD-001 and IPC-A-610
Two of the most widely referenced standards in the electronics industry are the IPC/EIA J-STD-001, Requirements for Soldered Electrical and Electronic Assemblies, and IPC-A-610, Acceptability of Electronic Assemblies, but did you know how these documents are updated and maintained by their associated IPC Committees? Learn how you can and should be a part of these ever changing documents and how to submit recommendations to affect change and consistency for the betterment of your company and others.
IPC/EIA J-STD-001 by the Numbers: Understanding the Key Supporting Documents
There is always one document that steals the show, in this case IPC/EIA J-STD-001, Requirements for Soldered Electrical and Electronic Assemblies, but are you aware of the top five(5) supporting documents that are critical to this one standard and directly impact the quality of both incoming and outgoing products? Take a moment to become familiar with new program offerings that address these key standards that will improve your quality and allow you to better converse with your suppliers.
Forward and Backward Soldering Compatibility
Just when you thought you understood all this lead and lead-free production, components of all types, leaded and lead-free start showing up in a variety of assemblies. How do you live in a world with only lead-free components that may end up in a leaded process and on the flip side, leaded components that might wind up in a lead-free process? Learn the process fundamentals and metallurgical issues to help guide you through this messy mix.