We hear/are asked this question all the time. When do I need to remove gold plating and why do I have too? Give us a moment to explain this issue, why it is required, when it is necessary and how removal is usually performed.
New Amendments to IPC-A-610F & J-STD-001F and What You Need to Know
You may or may not be aware that the IPC has released Amendments to the popular IPC-A-610F and J-STD-001F, but you may not be aware that they contain not only corrections to the current document revisions, but additional requirements not previously mentioned in the existing standards.
Tempered Leads, Class 3 Rework, Toe Fillets and More
We receive, almost on a daily basis, questions regarding production issues, standards and specification interpretation and just plain old, what is wrong with this manufacturing process. During this webinar, we would like to share some of the issues that other production people ...
A Review of IPC-6012 and Who This New Certification Can Help
IPC-6012 “Qualification and Performance Specification for Rigid Printed Boards” has been around for a while, but what you might not know, is that this document provides the foundation for the requirements that are found in the IPC-A-600 “The Acceptability of Printed Boards”.
Understanding What “The Lead is Discernible” Really Means
Yes, this simple term “discernible” is still debated to this day by many in the electronics manufacturing industry and a continually confusing concept for new students to grasp. Used throughout IPC-A-610 and J-STD-001, understanding this definition is critical to the application of the standards and their principles to the production process.
Tinning: Critical Care of Soldering Tips in a Lead Free Environment
Yes, we all know that you should be tinning your soldering iron tips between times of usage, but do you really understand the fundamentals of doing so, how it impacts heat transfer, time on a board pad and ultimately the quality of the solder joint and reliability of the component itself?
Selecting the Correct Crimp Terminal for the Job
So you have been crimping terminals to wires for years. Find the wire size, match it with the specified crimp terminal and you are on your way. Right? Well there is a bit more to it. What size terminal do you use if you have multiple wires being placed in one crimped terminal?
Damage Prevention When Soldering Ceramic Chip Capacitors
Ceramic chip capacitors have been around for years and used in a variety of assemblies, but as their size has shrunk over time, their susceptibility to damage has continued to rise. Add to this, the transition to lead free soldering materials, which have imposed more rigidity and reduced flexibility on solder joints, resulting in additional stress issues on these small devices.
Have a question about training or IPC certification?
EPTAC has the knowledge and expertise to help you train your staff, understand your process, and increase production. We are committed to answering your questions promptly, and we look forward to hearing from you.